Ken Holcomb

Title: Ken Holcomb: Innovator in High-Density Circuit Technology

Introduction

Ken Holcomb is a prominent inventor based in San Diego, CA. He has made significant contributions to the field of printed wiring boards, particularly through his innovative methods for producing high-density, multilayer circuits. His work has implications for various industries that rely on advanced electronic components.

Latest Patents

Ken Holcomb holds a patent for "Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias." This invention provides methods to mass laminate and interconnect high-density interconnect circuit layers fabricated through parallel processing. The methods employ an inside-out interconnection strategy that eliminates the need for plating of vias, resulting in defect-free outer circuit layers. Key features of this invention include the use of conductive paste and via layers, which enhance the overall performance and reliability of the circuits.

Career Highlights

Ken Holcomb is currently associated with Ormet Circuits, Inc., where he applies his expertise in circuit design and manufacturing. His innovative approaches have positioned him as a valuable asset in the field of electronics, contributing to advancements in circuit technology.

Collaborations

[This section has been skipped due to space constraints.]

Conclusion

Ken Holcomb's contributions to high-density circuit technology exemplify the impact of innovative thinking in the electronics industry. His patent and work at Ormet Circuits, Inc. highlight his role as a key figure in advancing circuit manufacturing techniques.