The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Jan. 16, 2014
Applicant:
Ormet Circuits, Inc., San Diego, CA (US);
Inventor:
Catherine A Shearer, San Marcos, CA (US);
Assignee:
Ormet Circuits, Inc., San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/264 (2013.01); B23K 35/266 (2013.01); B23K 35/268 (2013.01); B23K 35/30 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/3026 (2013.01); B23K 35/3033 (2013.01); B23K 35/362 (2013.01); B23K 35/3612 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 3/3463 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27418 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2932 (2013.01); H01L 2224/2936 (2013.01); H01L 2224/2938 (2013.01); H01L 2224/2946 (2013.01); H01L 2224/2948 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29301 (2013.01); H01L 2224/29305 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29313 (2013.01); H01L 2224/29314 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29317 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29338 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29349 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/29373 (2013.01); H01L 2224/29384 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29424 (2013.01); H01L 2224/29438 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29449 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29457 (2013.01); H01L 2224/29464 (2013.01); H01L 2224/29469 (2013.01); H01L 2224/29473 (2013.01); H01L 2224/29484 (2013.01); H01L 2224/29486 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/3201 (2013.01); H01L 2224/325 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/832 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83825 (2013.01);
Abstract
Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.