Richard Weaver

Title: Richard Weaver - Innovator in Semiconductor Packaging

Introduction

Richard Weaver is a notable inventor based in San Diego, CA. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative approach to die-attach materials. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

Richard Weaver holds a patent for "Semiconductor packaging containing sintering die-attach material." This invention provides a lead-free solution for semiconductor packages, offering superior electrical, thermal, and mechanical performance compared to prior art alternatives. The wafer-applied sintering materials create a metallurgical bond to both semiconductor die and adherends, ensuring durability throughout the die-attach joint without remelting at the original process temperature. The patent also discloses applications for either one or both sides of the wafer, as well as paste and film applications.

Career Highlights

Richard Weaver is currently employed at Ormet Circuits, Inc., where he continues to develop innovative solutions in semiconductor technology. His expertise in sintering die-attach materials has positioned him as a key player in the industry.

Collaborations

Richard has collaborated with talented coworkers, including Catherine A. Shearer and Michael C. Matthews, who contribute to the innovative environment at Ormet Circuits, Inc.

Conclusion

Richard Weaver's contributions to semiconductor packaging through his patented innovations demonstrate his commitment to advancing technology in this critical field. His work not only enhances product performance but also sets a standard for future developments in semiconductor materials.