The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Feb. 18, 2014
Applicants:
Ormet Circuits, Inc., San Diego, CA (US);
Integral Technology, Inc., Lake Forest, CA (US);
Inventors:
Christopher A Hunrath, San Juan Capistrano, CA (US);
Khang Duy Tran, Anaheim, CA (US);
Catherine A Shearer, San Marcos, CA (US);
Kenneth C Holcomb, San Diego, CA (US);
G Delbert Friesen, Santa Rosa, CA (US);
Assignees:
Ormet Circuits, Inc., San Diego, CA (US);
Integral Technology, Inc., Lake Forest, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4069 (2013.01); H05K 3/4614 (2013.01); H05K 3/4623 (2013.01); H05K 3/4652 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/1194 (2013.01);
Abstract
Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.