This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignees: Integral Technology, Inc., Ormet Circuits, Inc.. Active years: 2012-2017.
Company Filing History:
2 out of 2 
1 out of 13 Years Active: 2012-2017
Title: Christopher A. Hunrath: Innovator in Electronic Substrate Technology
Introduction
Christopher A. Hunrath is a notable inventor based in San Juan Capistrano, California. He has made significant contributions to the field of electronic substrates, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
Hunrath's latest patents include "Structures for z-axis interconnection of multilayer electronic substrates." This invention provides a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. The z-axis interconnection structures comprise a novel bonding film and conductive paste, along with one- and two-piece building block structures formed therefrom. Another significant patent is for an "Insulating layer for rigid printed circuit boards." This invention discloses rigid printed circuit boards (PCBs) and methods for manufacturing them, which include strain-resistant layers designed to minimize defects occurring in cap layers of the PCBs.
Career Highlights
Throughout his career, Hunrath has worked with several companies, including Integral Technology, Inc. and Ormet Circuits, Inc. His work has focused on advancing the technology behind electronic substrates, making him a key figure in this field.
Collaborations
Hunrath has collaborated with notable professionals such as Khang Duy Tran and Catherine A. Shearer, contributing to various projects that enhance electronic substrate technology.
Conclusion
Christopher A. Hunrath's innovative work in electronic substrates has led to significant advancements in the industry. His patents reflect a commitment to improving the reliability and efficiency of electronic components.