The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Feb. 14, 2020
Applicant:
Ormet Circuits, Inc., San Diego, CA (US);
Inventors:
Catherine A. Shearer, San Marcos, CA (US);
Peter A. Matturri, Del Mar, CA (US);
Michael C. Matthews, Encinitas, CA (US);
Assignee:
Ormet Circuits, Inc., San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/50 (2006.01); B32B 37/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/4855 (2013.01); B29C 65/4835 (2013.01); B29C 65/4875 (2013.01); B29C 65/489 (2013.01); B29C 65/5057 (2013.01); B32B 37/1207 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/3201 (2013.01);
Abstract
An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.