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Ningbo Semiconductor International Corporation

USPTO Granted Patents = 62

Forward Citations = 19

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29 inventors (with patents filed for the assignee):

Hailong Luo (19 out of 21 patents)

Mengbin Liu (17 out of 18 patents)

Clifford Ian Drowley (17 out of 28 patents)

4. Herb He Huang (12 out of 67 patents)

5. Da Chen (7 out of 7 patents)

6. Ji Guang Zhu (6 out of 6 patents)

7. Jiguang Zhu (6 out of 8 patents)

8. Haiting Li (6 out of 14 patents)

9. Xiaochuan Wang (5 out of 10 patents)

10. Hai Long Li (5 out of 19 patents)

11. Fei Qi (5 out of 7 patents)

12. Wei Li (3 out of 42 patents)

13. Guohuang Yang (3 out of 4 patents)

14. Zuopeng He (2 out of 5 patents)

15. Yanghui Xiang (2 out of 2 patents)

Core Competencies:

Acoustic Wave Resonator

Thin Film Technology

Fingerprint Identification Module

Wafer-Level Packaging

Photodetector Fabrication

CMOS Image Sensor

Microcontroller Unit

Gate Driver Integrated Circuit

Film Bulk Acoustic Resonator

Packaging Structure

Semiconductor Device

Image Capturing Assembly

62 patents: Sort by Forward Citations

1. 12224730 - Manufacturing method of a composite substrate of an acoustic wave resonator (2025-02-11),

2. 12057820 - Thin film piezoelectric acoustic wave resonator and manufacturing method therefor, and filter (2024-08-06),

3. 12028043 - Packaging method and packaging structure of FBAR (2024-07-02),

4. 12009803 - Bulk acoustic wave resonator, filter and radio frequency communication system (2024-06-11),

5. 11979136 - Air gap type semiconductor device package structure (2024-05-07),

6. 11942917 - Film bulk acoustic resonator and fabrication method thereof (2024-03-26),

7. 11923826 - Film bulk acoustic resonator and fabrication method thereof (2024-03-05),

8. 11917918 - Fingerprint identification module, method for forming fingerprint identification module, and electronic device (2024-02-27),

9. 11870410 - Packaging method and packaging structure of film bulk acoustic resonator (2024-01-09),

10. 11848657 - Film bulk acoustic resonator and fabrication method thereof (2023-12-19),

11. 11764245 - Fabrication method of photodetector and imaging sensor (2023-09-19),

12. 11641184 - Film bulk acoustic resonator (2023-05-02),

13. 11601106 - Thin-film bulk acoustic resonator and semiconductor apparatus comprising the same (2023-03-07),

14. 11575358 - Thin-film bulk acoustic resonator and semiconductor apparatus comprising the same (2023-02-07),

15. 11569790 - Method for forming film bulk acoustic resonator (2023-01-31),

Ningbo Semiconductor International Corporation (NSIC) is a leading semiconductor company headquartered in Ningbo, Zhejiang, China. NSIC specializes in the research, development, and manufacturing of high-performance semiconductor products for various industries, including consumer electronics, automotive, telecommunications, and more. With a focus on innovation and cutting-edge technology, NSIC aims to provide reliable and advanced semiconductor solutions to customers worldwide. For more information, please visit their official website.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

62 Patents

#5 in Ningbo

#479 in China

#11,476 in the World

Ningbo Semiconductor International Corporation

Forward Citations = 19

29 inventors:

Hailong Luo (19 out of 21 patents)

Mengbin Liu (17 out of 18 patents)

Clifford Ian Drowley (17 out of 28 patents)

4. Herb He Huang (12 out of 67 patents)

5. Da Chen (7 out of 7 patents)

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