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Ningbo Semiconductor International Corporation

USPTO Granted Patents = 63

Forward Citations = 21

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29 inventors (with patents filed for the assignee):

Hailong Luo (20 out of 22 patents)

Mengbin Liu (17 out of 18 patents)

Clifford Ian Drowley (17 out of 28 patents)

4. Herb He Huang (13 out of 68 patents)

5. Da Chen (7 out of 7 patents)

6. Ji Guang Zhu (6 out of 6 patents)

7. Jiguang Zhu (6 out of 8 patents)

8. Haiting Li (6 out of 14 patents)

9. Xiaochuan Wang (5 out of 10 patents)

10. Hai Long Li (5 out of 19 patents)

11. Fei Qi (5 out of 7 patents)

12. Wei Li (4 out of 45 patents)

13. Guohuang Yang (3 out of 4 patents)

14. Zuopeng He (2 out of 5 patents)

15. Yanghui Xiang (2 out of 2 patents)

Core Competencies:

Acoustic Wave Resonator

Thin-Film Technology

Packaging Methods

Semiconductor Devices

Image Sensors

Wafer-Level Packaging

Fingerprint Identification

Interconnect Structures

CMOS Technology

Photodetectors

Resonator Manufacturing

RFIC Devices

63 patents: Sort by Forward Citations

1. 12732159 - Film bulk acoustic resonator and fabrication method thereof (2026-09-08),

2. 12224730 - Manufacturing method of a composite substrate of an acoustic wave resonator (2025-02-11),

3. 12057820 - Thin film piezoelectric acoustic wave resonator and manufacturing method therefor, and filter (2024-08-06),

4. 12028043 - Packaging method and packaging structure of FBAR (2024-07-02),

5. 12009803 - Bulk acoustic wave resonator, filter and radio frequency communication system (2024-06-11),

6. 11979136 - Air gap type semiconductor device package structure (2024-05-07),

7. 11942917 - Film bulk acoustic resonator and fabrication method thereof (2024-03-26),

8. 11923826 - Film bulk acoustic resonator and fabrication method thereof (2024-03-05),

9. 11917918 - Fingerprint identification module, method for forming fingerprint identification module, and electronic device (2024-02-27),

10. 11870410 - Packaging method and packaging structure of film bulk acoustic resonator (2024-01-09),

11. 11848657 - Film bulk acoustic resonator and fabrication method thereof (2023-12-19),

12. 11764245 - Fabrication method of photodetector and imaging sensor (2023-09-19),

13. 11641184 - Film bulk acoustic resonator (2023-05-02),

14. 11601106 - Thin-film bulk acoustic resonator and semiconductor apparatus comprising the same (2023-03-07),

15. 11575358 - Thin-film bulk acoustic resonator and semiconductor apparatus comprising the same (2023-02-07),

Company Overview

Ningbo Semiconductor International Corporation, headquartered in Ningbo, China, specializes in the development and manufacturing of bulk acoustic resonators. The company focuses on advanced technologies such as acoustic wave resonators, thin-film technology, and innovative packaging methods. Its expertise extends to semiconductor devices, image sensors, and wafer-level packaging, catering to applications in fingerprint identification and interconnect structures. With a commitment to cutting-edge research, NSIC plays a pivotal role in the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

63 Patents

#7 in Ningbo

#518 in China

#11,627 in the World

Ningbo Semiconductor International Corporation

Forward Citations = 21

29 inventors:

Hailong Luo (20 out of 22 patents)

Mengbin Liu (17 out of 18 patents)

Clifford Ian Drowley (17 out of 28 patents)

4. Herb He Huang (13 out of 68 patents)

5. Da Chen (7 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ningbo Semiconductor International Corporation. Retrieved from https://idiyas.com/company/ningbo-semiconductor-international

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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