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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11917918 B1

PDFFull Text
Date of Patent:
Feb. 27, 2024

Filed:

Mar. 09, 2021

Fingerprint identification module, method for forming fingerprint identification module, and electronic device

Applicant:

Ningbo Semiconductor International Corporation, Ningbo, CN;

Inventors:

Hu Shi, Ningbo, CN;

Mengbin Liu, Ningbo, CN;

Yanghui Xiang, Ningbo, CN;

Assignee:

NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION, Ningbo, CN;

Attorney:

Anova Law Group, PLLC

Primary Examiner:

Abhishek Sarma

Int. Cl.
CPC ...
H10N 30/30 (2023.01); G06V 40/13 (2022.01); H10N 30/05 (2023.01); H10N 30/072 (2023.01); H10N 30/87 (2023.01); H10N 30/00 (2023.01);
U.S. Cl.
CPC ...
H10N 30/302 (2023.02); G06V 40/1306 (2022.01); H10N 30/05 (2023.02); H10N 30/072 (2023.02); H10N 30/10516 (2023.02); H10N 30/874 (2023.02);
Abstract

Fingerprint identification modules, methods for forming the fingerprint identification modules and electronic devices are provided. The method may include providing a substrate, containing a signal process circuit formed therein; providing a carrier substrate; forming one or more piezoelectric transducers on the carrier substrate, wherein a piezoelectric transducer of the one or more piezoelectric transducers includes a first electrode, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer; forming a permanent bonding layer, containing one or more cavities, on one of the carrier substrate and the substrate; bonding the carrier substrate with the substrate using the permanent bonding layer, wherein the permanent bonding layer is between the one or more piezoelectric transducers and the substrate, and each piezoelectric transducer covers one cavity; and removing the carrier substrate.

Find Patent Forward Citations

Shi, Hu. (2024). Fingerprint identification module, method for forming fingerprint identification module, and electronic device (U.S. Patent No. 11917918). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11917918

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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