Company Filing History:
Years Active: 2020-2024
Title: The Innovations of Hu Shi
Introduction
Hu Shi is a prominent inventor based in Ningbo, China. He has made significant contributions to the field of technology, particularly in the area of fingerprint identification and wafer-level packaging methods. With a total of two patents to his name, Hu Shi continues to push the boundaries of innovation.
Latest Patents
Hu Shi's latest patents include a fingerprint identification module and a method for forming this module. The technology involves a substrate containing a signal processing circuit, a carrier substrate, and piezoelectric transducers. These transducers are designed to enhance the efficiency of fingerprint identification systems. Additionally, he has developed wafer-level packaging methods that utilize a photolithographic bonding material. This method involves a base substrate and first chips, with a focus on creating conductive vias for electrical connections.
Career Highlights
Hu Shi is associated with Ningbo Semiconductor International Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices through innovative packaging solutions.
Collaborations
Hu Shi collaborates with notable colleagues such as Mengbin Liu and Yanghui Xiang. Their combined efforts contribute to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Hu Shi's contributions to fingerprint identification and wafer-level packaging highlight his role as a key innovator in the technology sector. His work continues to influence advancements in electronic devices and semiconductor technology.