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For the Inventor, By the Inventor

Ningbo, China

Hailong Luo

USPTO Granted Patents = 20 

Average Co-Inventor Count = 1.7

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Ningbo, CN (2020 - 2024)
  • Zhejiang, CN (2024)

Company Filing History:

goldMedal19 out of 61 
 
Ningbo Semiconductor International Corporation
 patents
silverMedal1 out of 3 
 
Ningbo Semiconductor International Corporation (shanghai Branch)
 patents

Years Active: 2020-2025

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20 patents (USPTO):Explore Patents
1. 12224730 - Manufacturing method of a composite substrate of an acoustic wave resonator (2025-02-11),
2. 12081191 - Packaging method of a film bulk acoustic resonator (2024-09-03),
3. 12057820 - Thin film piezoelectric acoustic wave resonator and manufacturing method therefor, and filter (2024-08-06),
4. 12028043 - Packaging method and packaging structure of FBAR (2024-07-02),
5. 12009803 - Bulk acoustic wave resonator, filter and radio frequency communication system (2024-06-11),
6. 11870410 - Packaging method and packaging structure of film bulk acoustic resonator (2024-01-09),
7. 11764245 - Fabrication method of photodetector and imaging sensor (2023-09-19),
8. 11562980 - Wafer-level package structure (2023-01-24),
9. 11450582 - Wafer-level package structure (2022-09-20),
10. 11444244 - Mask plate and fabrication method thereof (2022-09-13),
11. 11309279 - Package structure of wafer-level system-in-package (2022-04-19),
12. 11101311 - Photodetector and fabrication method, and imaging sensor (2021-08-24),
13. 10978421 - Wafer-level packaging method and package structure (2021-04-13),
14. 10910286 - Wafer-level system-in-package packaging method and package structure thereof (2021-02-02),
15. 10861822 - Wafer-level packaging method and package structure thereof (2020-12-08),

Title: Innovations and Achievements of Hailong Luo in Acoustic Wave Technology

Introduction: Hailong Luo, based in Ningbo, China, is a prominent inventor with a robust portfolio that includes 20 patents. His contributions to the field of acoustic wave technology have paved the way for advancements in resonator manufacturing and packaging methods.

Latest Patents: Hailong Luo's latest innovations demonstrate his expertise in acoustic wave resonators. His manufacturing method of a composite substrate for acoustic wave resonators outlines a detailed process that involves the integration of a piezoelectric plate with a carefully designed base structure. This composite substrate not only enhances performance but also simplifies the manufacturing process. Additionally, his work on the packaging method of film bulk acoustic resonators introduces a novel packaging structure that efficiently bonds the resonant cavity main structure with a resonator cover, providing a reliable and conductive interconnection layer.

Career Highlights: Hailong has worked for notable organizations, including Ningbo Semiconductor International Corporation and its Shanghai branch. His tenure at these companies has allowed him to contribute significantly to the semiconductor industry, particularly in the development of resonator technologies that are crucial for various electronic applications.

Collaborations: Throughout his career, Hailong Luo has collaborated with esteemed colleagues like Clifford Ian Drowley and Wei Li. These partnerships have enabled him to merge ideas and enhance the research and development of innovative technologies in his field.

Conclusion: Hailong Luo's ongoing contributions to acoustic wave technology highlight his standing as an influential inventor. His innovative patents and dedication to advancing manufacturing techniques set a strong foundation for the future of acoustic devices, reflecting the importance of creativity and collaboration in driving technological progress.

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