The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Feb. 26, 2021
Ningbo Semiconductor International Corporation (Shanghai Branch), Shanghai, CN;
Hailong Luo, Ningbo, CN;
Fei Qi, Ningbo, CN;
Abstract
The present disclosure provides a packaging module and packaging method of a BAW resonator. The packaging method includes: bonding a BAW resonant device including a first substrate and a resonant structure provided on the first substrate to a second substrate through a bonding layer; forming through holes exposing corresponding electrical connection portions of the resonant structure at a side of the first substrate; and forming a conductive interconnection layer on inner surfaces of the through holes and on a portion of a surface of the first substrate to avoid steps of etching through holes and depositing conductive materials from the bonding layer, so that a material of the bonding layer can be selected to provide good bonding effect, which helps to reduce the process difficulty, and improves the stability of the through holes and the formed packaging module, thereby improving the performance of the BAW resonator packaging structure.