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For the Inventor, By the Inventor

Shanghai, China

Ningbo Semiconductor International Corporation (Shanghai Branch)


USPTO Granted Patents = 4

Forward Citations = 1

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6 inventors (with patents filed for the assignee):

goldMedal Hailong Luo (2 out of 21 patents)

silverMedal Mengbin Liu (1 out of 18 patents)

bronzeMedal Xiaoshan Qin (1 out of 1 patent)

4.  Situo Xu (1 out of 2 patents)

5.  Yunxiang Di (1 out of 2 patents)

6.  Fei Qi (1 out of 7 patents)


4 patents:

1. 12506458 - Packaging module and packaging method of BAW resonator (2025-12-23),
2. 12081191 - Packaging method of a film bulk acoustic resonator (2024-09-03),
3. 11695387 - Air gap type semiconductor device package structure and fabrication method thereof (2023-07-04),
4. 11667518 - MEMS packaging structure and manufacturing method therefor (2023-06-06),
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USPTO Data Jan 1 1976 - Jan 6 2026

4 Patents

#471 in Shanghai

#5,623 in China

...
Shanghai, China

Ningbo Semiconductor International Corporation (Shanghai Branch)

Forward Citations = 1

6 inventors:

goldMedal Hailong Luo (2 out of 21 patents)

silverMedal Mengbin Liu (1 out of 18 patents)

bronzeMedal Xiaoshan Qin (1 out of 1 patent)

4.  Situo Xu (1 out of 2 patents)

5.  Yunxiang Di (1 out of 2 patents)

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