Company Filing History:
Years Active: 2023
Title: Innovations of Xiaoshan Qin in MEMS Technology
Introduction
Xiaoshan Qin is a notable inventor based in Zhejiang, China. He has made significant contributions to the field of micro-electro-mechanical systems (MEMS). His innovative work focuses on enhancing the packaging structures and manufacturing methods for MEMS devices.
Latest Patents
Xiaoshan Qin holds a patent for a MEMS packaging structure and the manufacturing method associated with it. This patent describes a micro-electro-mechanical system (MEMS) package structure that includes a MEMS die and a device wafer. The structure features a control unit and an interconnection structure formed within the device wafer. A first contact pad and an input-output connecting member are created on the first bonding surface of the device wafer. The MEMS die is coupled to this bonding surface through a bonding layer. The design allows for electrical interconnection between the MEMS die and the device wafer while reducing the overall package size compared to existing integration techniques. Additionally, the package structure enhances functional integration by accommodating multiple MEMS dies of varying structures and functions on the same device wafer.
Career Highlights
Xiaoshan Qin is currently associated with Ningbo Semiconductor International Corporation, specifically at its Shanghai branch. His role in the company allows him to further develop and implement his innovative ideas in MEMS technology.
Collaborations
Throughout his career, Xiaoshan