Company Filing History:
1 out of 4 
1 out of 62 Years Active: 2023-2024
Title: Innovations of Yunxiang Di in Semiconductor Technology
Introduction
Yunxiang Di is a notable inventor based in Ningbo, China, recognized for his contributions to semiconductor technology. With a total of two patents to his name, he has made significant advancements in the field of semiconductor device packaging.
Latest Patents
Yunxiang Di's latest patents include an innovative air gap type semiconductor device package structure. This package structure features a carrier, a semiconductor chip, and a bonding layer positioned between the carrier and the semiconductor chip. A first cavity is created in the bonding layer, enclosed by the semiconductor chip and the carrier, aligning with a portion of the active region of the semiconductor chip. The encapsulation layer and the bonding layer are situated on the same side of the carrier, encapsulating the semiconductor chip and an exposed region of the bonding layer. Additionally, interconnection structures are formed on the opposite side of the carrier, ensuring electrical connections to the corresponding input/output electrodes of the semiconductor chip. His second patent details the fabrication method for this air gap type semiconductor device package structure, which includes forming a bonding layer with a first opening, disposing a semiconductor chip, and encapsulating the chip on the carrier.
Career Highlights
Yunxiang Di has worked with Ningbo Semiconductor International Corporation, where he has contributed to various projects in semiconductor technology. His experience at the Shanghai branch of the same corporation has further enhanced his expertise in the field