Company Filing History:
1 out of 4 
1 out of 62 Years Active: 2023-2024
Title: Innovations of Situo Xu in Semiconductor Technology
Introduction
Situo Xu is a notable inventor based in Ningbo, China, recognized for his contributions to semiconductor technology. With a total of two patents to his name, Xu has made significant advancements in the design and fabrication of semiconductor device packages. His work reflects a deep understanding of the complexities involved in modern electronics.
Latest Patents
Situo Xu's latest patents include innovative designs for air gap type semiconductor device package structures. The first patent describes a package structure that incorporates a carrier, a semiconductor chip, and a bonding layer. This design features a first cavity formed in the bonding layer, which is aligned with a portion of the active region of the semiconductor chip. The encapsulation layer and bonding layer are positioned on the same side of the carrier, effectively encapsulating the semiconductor chip and an exposed region of the bonding layer. Additionally, interconnection structures are formed on the opposite side of the carrier, ensuring electrical connectivity to the input/output electrodes of the semiconductor chip.
The second patent focuses on the fabrication method of the air gap type semiconductor device package. This method involves creating a bonding layer with a first opening on a carrier, placing a semiconductor chip on the bonding layer, and performing an encapsulation process. The process concludes with the formation of through holes aligned with the input/output electrode regions of the semiconductor chip, allowing for efficient electrical connections.
Career Highlights
Situo Xu