The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Feb. 26, 2021
Applicant:

Ningbo Semiconductor International Corporation, Ningbo, CN;

Inventor:

Hailong Luo, Ningbo, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01); H03H 9/17 (2006.01);
U.S. Cl.
CPC ...
H03H 9/105 (2013.01); H03H 3/02 (2013.01); H03H 9/0523 (2013.01); H03H 9/173 (2013.01); H03H 2003/021 (2013.01);
Abstract

The present disclosure provides a packaging method and packaging structure of an FBAR. A second cavity in a resonator cover provided includes a groove in a second substrate and a space surrounded by an elastic bonding material layer. The elastic bonding material layer bonds the resonator cover to a resonant cavity main structure, and elasticity of the elastic bonding material layer is removed after the bonding. Through holes and a conductive interconnection layer on inner surfaces of the through holes are formed on the resonator cover. Since the second cavity includes the groove in the second substrate and the space surrounded by the elastic bonding material layer, which can avoid problems that performance of the elastic bonding material layer is unstable with temperature and humidity changes when the second cavity is entirely surrounded by the elastic bonding material layer, that is, the stability of the resonator is improved.


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