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For the Inventor, By the Inventor

Boulder, CO, United States of America

Kelvin Thermal Technologies, Inc.


USPTO Granted Patents = 18

Forward Citations = 107

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23 inventors (with patents filed for the assignee):

goldMedal Yung-Cheng Lee (16 out of 25 patents)

silverMedal Ryan John Lewis (12 out of 15 patents)

bronzeMedal Ronggui Yang (10 out of 23 patents)

4.  Victor M Bright (5 out of 20 patents)

5.  Chen Li (5 out of 6 patents)

6.  Christopher Oshman (5 out of 6 patents)

7.  Bo Shi (5 out of 6 patents)

8.  George P Peterson (5 out of 6 patents)

9.  Jen-Hau Cheng (4 out of 5 patents)

10.  Li-Anne Liew (4 out of 6 patents)

11.  Yunda Wang (3 out of 3 patents)

12.  Takuo Wakaoka (2 out of 15 patents)

13.  Keijiro Kojima (2 out of 6 patents)

14.  Jason W West (2 out of 2 patents)

15.  Kyle Wagner (2 out of 2 patents)


18 patents:

1. 12607413 - Polymer-based microfabricated thermal ground plane (2026-04-21),
2. 12523431 - Polymer-based microfabricated thermal ground plane (2026-01-13),
3. 12498181 - Vapor chamber (2025-12-16),
4. 12480716 - Thermal management planes (2025-11-25),
5. 12464679 - Folding thermal ground plane (2025-11-04),
6. 12385697 - Micropillar-enabled thermal ground plane (2025-08-12),
7. 12104856 - Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems (2024-10-01),
8. 11988453 - Thermal management planes (2024-05-21),
9. 11930621 - Folding thermal ground plane (2024-03-12),
10. 11445636 - Vapor chamber, heatsink device, and electronic device (2022-09-13),
11. 11353269 - Thermal ground plane (2022-06-07),
12. 10724804 - Method and device for spreading high heat fluxes in thermal ground planes (2020-07-28),
13. 10571200 - Thermal ground plane (2020-02-25),
14. 10527358 - Thermal ground plane (2020-01-07),
15. 10446466 - Mechanically improved microelectronic thermal interface structure for low die stress (2019-10-15),
Company Overview
Kelvin Thermal Technologies, Inc. is a Boulder, Colorado-based company specializing in advanced thermal management solutions. The organization focuses on developing innovative materials and systems designed to enhance thermal performance across various applications, including electronics, automotive, and industrial sectors. By leveraging cutting-edge research in thermal dynamics, Kelvin Thermal aims to address the growing demand for efficient heat management technologies, contributing to improved energy efficiency and sustainability in modern engineering.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

18 Patents

#74 in Boulder, CO

#371 in Colorado

#17,963 in US

#34,217 in the World

Boulder, CO (US)
Boulder, CO, United States of America

Kelvin Thermal Technologies, Inc.

Forward Citations = 107

23 inventors:

goldMedal Yung-Cheng Lee (16 out of 25 patents)

silverMedal Ryan John Lewis (12 out of 15 patents)

bronzeMedal Ronggui Yang (10 out of 23 patents)

4.  Victor M Bright (5 out of 20 patents)

5.  Chen Li (5 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Kelvin Thermal Technologies, Inc.. Retrieved from https://idiyas.com/company/kelvin-thermal-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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