The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Nov. 11, 2019
Applicant:

Kelvin Thermal Technologies, Inc., Boulder, CO (US);

Inventors:

Ronggui Yang, Broomfield, NY (US);

Yung-Cheng Lee, Boulder, CO (US);

Victor M. Bright, Boulder, CO (US);

Chen Li, Columbia, SC (US);

Christopher Oshman, Boulder, CO (US);

Bo Shi, Nanjing, CN;

Jen-Hau Cheng, Boulder, CO (US);

George P. Peterson, Atlanta, GA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); B23P 15/26 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0241 (2013.01); B23P 15/26 (2013.01); F28D 15/0233 (2013.01); F28D 15/04 (2013.01); F28D 15/046 (2013.01); H01L 23/3677 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); B23P 2700/09 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49353 (2015.01);
Abstract

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.


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