Jen-Hau Cheng

Title: Innovations of Jen-Hau Cheng

Introduction

Jen-Hau Cheng is a notable inventor based in Boulder, Colorado, recognized for his contributions to thermal management technologies. He holds a total of five patents, showcasing his innovative approach to engineering solutions.

Latest Patents

One of his latest patents involves a flexible thermal ground plane. This invention includes methods, apparatuses, and systems designed for flexible thermal ground planes. The flexible thermal ground plane may consist of a support member, along with an evaporator region or multiple evaporator regions configured to couple with the support member. Additionally, it may feature a condenser region or multiple condenser regions also configured to couple with the support member. The evaporator and condenser regions may incorporate a microwicking structure, as well as a nanowicking structure that includes nanorods. Furthermore, these regions may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may also feature a micromesh coupled with the nanorods and/or the microwicking structure.

Career Highlights

Throughout his career, Jen-Hau Cheng has worked with companies such as Kelvin Thermal Technologies, Inc. and Kevlin Thermal Technologies, Inc. His work has significantly advanced the field of thermal management.

Collaborations

Jen-Hau Cheng has collaborated with notable individuals in his field, including Ronggui Yang and Yung-Cheng Lee.

Conclusion

Jen-Hau Cheng's innovative contributions to thermal management technologies highlight his expertise and commitment to advancing engineering solutions. His patents reflect a deep understanding of flexible thermal ground planes and their applications.