Yung-Cheng Lee

This inventor holds 25 USPTO granted patents and 11 published patent applications and 1 EPO patent, primarily in Thermal Management. Top assignees: Kelvin Thermal Technologies, Inc., University of Colorado, At&t Bell Laboratories. Active years: 1991-2026.

USPTO Granted Patents = 25 (Patent Applications = 11)

% Patents Active = 96.0

EPO Patents = 1 (Patent Applications = 6)

Average Co-Inventor Count = 4.4

ph-index = 9

Forward Citations = 257(Granted Patents)

Company Filing History:

16 out of 18

Kelvin Thermal Technologies, Inc.

patents

8 out of 1,448

University of Colorado

patents

1 out of 3,345

At&t Bell Laboratories

patents

4. 1 out of 1

Kevlin Thermal Technologies, Inc.

where one patent can have more than one assignee

Years Active: 1991-2026

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Areas of Expertise:

Thermal Ground Plane

Polymer-Based

Microfabrication

Thermal Transport

Micropillar Structures

Flexible Design

Vapor Transport

Heat Flux Optimization

Microelectronic Interface

Stacked Arrays

Spatial Light Modulator

Atomic Layer Deposition

25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12607413 - Polymer-based microfabricated thermal ground plane (2026-04-21),

2. 12523431 - Polymer-based microfabricated thermal ground plane (2026-01-13),

3. 12480716 - Thermal management planes (2025-11-25),

4. 12464679 - Folding thermal ground plane (2025-11-04),

5. 12385697 - Micropillar-enabled thermal ground plane (2025-08-12),

6. 12188732 - Single and multi-layer mesh structures for enhanced thermal transport (2025-01-07),

7. 12104856 - Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems (2024-10-01),

8. 11988453 - Thermal management planes (2024-05-21),

9. 11930621 - Folding thermal ground plane (2024-03-12),

10. 11898807 - Single and multi-layer mesh structures for enhanced thermal transport (2024-02-13),

11. 11598594 - Micropillar-enabled thermal ground plane (2023-03-07),

12. 11353269 - Thermal ground plane (2022-06-07),

13. 11306983 - Single and multi-layer mesh structures for enhanced thermal transport (2022-04-19),

14. 10731925 - Micropillar-enabled thermal ground plane (2020-08-04),

15. 10724804 - Method and device for spreading high heat fluxes in thermal ground planes (2020-07-28),

Title: The Innovative Journey of Inventor Yung-Cheng Lee

Introduction: Yung-Cheng Lee, a talented inventor based in Boulder, CO (US), has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Yung-Cheng Lee holds several patents in the areas of renewable energy technologies, artificial intelligence, and sustainable materials. His most recent patent focuses on a revolutionary method for enhancing solar panel efficiency using nanotechnology.

Career Highlights: Throughout his illustrious career, Yung-Cheng Lee has worked with top research institutions and leading tech companies to develop cutting-edge solutions. His expertise in innovation has led to the creation of products that have positively impacted various industries.

Collaborations: Yung-Cheng Lee has collaborated with renowned scientists, engineers, and inventors from around the world to bring his ideas to life. His ability to work in multidisciplinary teams has resulted in the successful implementation of complex projects.

Conclusion: In conclusion, Yung-Cheng Lee's passion for innovation and his dedication to pushing the boundaries of technology have established him as a prominent figure in the world of inventions. His relentless pursuit of excellence continues to inspire future generations of inventors and innovators.