The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Sep. 17, 2015
Applicant:

Kelvin Thermal Technologies, Inc., Boulder, CO (US);

Inventors:

Ryan John Lewis, Boulder, CO (US);

Li-Anne Liew, Westminster, CO (US);

Ching-Yi Lin, Longmont, CO (US);

Collin Jennings Coolidge, Longmont, CO (US);

Shanshan Xu, Boulder, CO (US);

Ronggui Yang, Boulder, CO (US);

Yung-Cheng Lee, Boulder, CO (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); F28F 21/08 (2006.01); G06F 1/20 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); F28D 15/0233 (2013.01); F28F 21/085 (2013.01); G06F 1/203 (2013.01); H01L 23/427 (2013.01); F28F 2225/00 (2013.01); F28F 2240/00 (2013.01); F28F 2245/02 (2013.01); F28F 2245/04 (2013.01); H05K 7/20336 (2013.01);
Abstract

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.


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