Li-Anne Liew

Title: The Innovative Journey of Li-Anne Liew

Introduction

Li-Anne Liew is a prominent inventor based in Westminster, Colorado. She has made significant contributions to the field of thermal management technology, holding a total of four patents. Her work focuses on enhancing the efficiency of thermal ground planes, which are crucial in various applications.

Latest Patents

One of Li-Anne Liew's latest patents is the Micropillar-enabled thermal ground plane. This invention discloses a thermal ground plane (TGP) that includes a first planar substrate member made of copper and a second planar substrate member made of metal. These two members enclose a working fluid, which is essential for thermal management. The TGP features a first plurality of pillars on the interior surface of the first planar substrate, topped with a mesh layer that can be composed of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. Additionally, a second plurality of pillars is located on the interior surface of the second planar substrate, extending to the mesh layer, thereby enhancing the thermal performance of the device.

Career Highlights

Li-Anne has worked with notable organizations such as the University of Colorado and Kelvin Thermal Technologies, Inc. Her experience in these institutions has allowed her to develop and refine her innovative ideas in thermal technology.

Collaborations

Throughout her career, Li-Anne has collaborated with talented individuals, including Ryan John Lewis and Yung-Cheng Lee. These partnerships have contributed to her success and the advancement of her inventions.

Conclusion

Li-Anne Liew's contributions to thermal management technology through her innovative patents highlight her expertise and dedication to the field. Her work continues to influence advancements in thermal ground plane technology, showcasing her role as a leading inventor.