The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Oct. 28, 2015
Applicant:

Kelvin Thermal Technologies, Inc., Boulder, CO (US);

Inventors:

Ryan John Lewis, Boulder, CO (US);

Yung-Cheng Lee, Boulder, CO (US);

Li-Anne Liew, Westminster, CO (US);

Yunda Wang, Denver, CO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); F28D 15/04 (2006.01); B23P 15/26 (2006.01); C23F 4/00 (2006.01); F28F 13/18 (2006.01); F28D 15/02 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); B23P 15/26 (2013.01); B81C 1/00388 (2013.01); C23F 4/00 (2013.01); F28D 15/0233 (2013.01); F28F 13/187 (2013.01); B81C 2201/0108 (2013.01);
Abstract

Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.


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