Ryan John Lewis

Title: Innovations of Ryan John Lewis

Introduction

Ryan John Lewis is a prominent inventor based in Boulder, Colorado. He holds a total of 10 patents, showcasing his significant contributions to the field of thermal management technologies. His work primarily focuses on optimizing thermal ground planes, which are essential in various applications.

Latest Patents

One of his latest patents is titled "Micropillar-enabled thermal ground plane." This invention discloses a thermal ground plane that includes a first planar substrate member made of copper and a second planar substrate member made of a metal. These members enclose a working fluid and feature a first plurality of pillars on the interior surface of the first planar substrate, along with a mesh layer on top of these pillars. The mesh layer can be composed of materials such as copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. Additionally, the thermal ground plane includes a second plurality of pillars on the interior surface of the second planar substrate, extending to the mesh layer.

Another significant patent is the "Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems." This invention features a thermal ground plane with a variable thickness vapor core. It consists of a first casing and a second casing that enclose a working fluid. The design includes an evaporator region and a condenser region, along with a wicking layer between the casings. The vapor core is defined by a gap between the casings, which can vary in thickness.

Career Highlights

Ryan John Lewis has worked with notable organizations such as Kelvin Thermal Technologies, Inc. and the University of Colorado. His experience in these institutions has allowed him to develop and refine his innovative ideas in thermal management.

Collaborations

He has collaborated with esteemed colleagues, including Yung-Cheng Lee and Ronggui Yang, contributing to advancements in thermal technologies.

Conclusion

Ryan John Lewis is a distinguished inventor whose work in thermal ground planes has led to significant innovations. His patents reflect a deep understanding of thermal management, making him a valuable contributor to the field.