The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Nov. 17, 2021
Applicant:

Kelvin Thermal Technologies, Inc., Boulder, CO (US);

Inventors:

Ryan J. Lewis, Boulder, CO (US);

Ronggui Yang, Broomfield, CO (US);

Yung-Cheng Lee, Boulder, CO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28D 15/04 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0283 (2013.01); F28D 15/0233 (2013.01); F28D 15/04 (2013.01); H01L 23/427 (2013.01); H05K 7/20336 (2013.01); F28D 15/0241 (2013.01); F28F 2265/00 (2013.01);
Abstract

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.


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