The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Oct. 18, 2017
Applicant:

Kelvin Thermal Technologies, Inc., Boulder, CO (US);

Inventors:

Ryan John Lewis, Boulder, CO (US);

Ronggui Yang, Broomfield, NY (US);

Yung-Cheng Lee, Boulder, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); B23P 15/26 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); F28D 15/02 (2013.01); F28D 15/0233 (2013.01); F28D 15/04 (2013.01); H01L 23/427 (2013.01); H01L 23/433 (2013.01); B23P 15/26 (2013.01);
Abstract

Some embodiments of the invention include a thermal ground plane with a variable thickness vapor core. For example, a thermal ground plan may include a first casing and a second casing where the second casing and the first casing configured to enclose a working fluid. The thermal ground plane may also include an evaporator region disposed at least partially on at least one of the first casing and the second casing; a condenser region disposed at least partially on at least one of the first casing and the second casing; and a wicking layer disposed between the first casing and the second casing a vapor core defined at least partially by a gap between the first casing and the second casing. The thickness of the gap can vary across the first casing and the second casing.


Find Patent Forward Citations

Quick Actions:

Lewis, Ryan. (2024). Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems (U.S. Patent No. 12104856). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12104856

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