The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Mar. 07, 2023
Kelvin Thermal Technologies, Inc., Boulder, CO (US);
Ryan John Lewis, Boulder, CO (US);
Li-Anne Liew, Westminster, CO (US);
Ching-Yi Lin, Longmont, CO (US);
Collin Jennings Coolidge, Longmont, CO (US);
Shanshan Xu, Boulder, CO (US);
Ronggui Yang, Boulder, CO (US);
Yung-Cheng Lee, Boulder, CO (US);
Kelvin Thermal Technologies, Inc., Boulder, CO (US);
Abstract
A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.