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For the Inventor, By the Inventor

Trübbach, Switzerland

Evatec Ag


USPTO Granted Patents = 50


Trademarks = 4

Forward Citations = 124

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52 inventors (with patents filed for the assignee):

goldMedal Jurgen Weichart (11 out of 14 patents)

silverMedal Stanislav Kadlec (7 out of 17 patents)

bronzeMedal Juergen Weichart (6 out of 14 patents)

4.  Rogier Lodder (6 out of 7 patents)

5.  Mohamed Elghazzali (5 out of 7 patents)

6.  Bart Scholte Von Mast (5 out of 6 patents)

7.  Stephan Voser (5 out of 5 patents)

8.  Hartmut Rohrmann (5 out of 6 patents)

9.  Martin Bless (4 out of 4 patents)

10.  Rolf Bazlen (4 out of 6 patents)

11.  Wolfgang Rietzler (4 out of 5 patents)

12.  Sven Uwe Rieschl (4 out of 4 patents)

13.  Bruno Gaechter (4 out of 4 patents)

14.  Martin Kratzer (4 out of 5 patents)

15.  Jürgen Weichart (4 out of 8 patents)


Core Competencies:
Piezoelectric Coatings
Thin Film Deposition
Sputtering Apparatus
Vacuum Treatment
Magnetron Sputtering
Plasma Etching
RF Power Delivery
High Power Impulse Magnetron Sputtering
Optical Monitoring
Substrate Processing
Liquid Sputter Target
Directional Layer Deposition

50 patents:

1. 12493016 - Measuring device and method for measuring parameters of a piezoelectric crystal onto which a thin film of material is deposited as well as thin-film deposition systems with such a device and a method for controlling such systems (2025-12-09),
2. 12426506 - Piezoelectric coating and deposition process (2025-09-23),
3. 12389797 - Deposition process for piezoelectric coatings (2025-08-12),
4. 12272525 - Sputtering apparatus for coating of 3D-objects (2025-04-08),
5. 12249523 - Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer (2025-03-11),
6. 12211715 - Substrate vacuum treatment apparatus and method therefor (2025-01-28),
7. 12209302 - Vacuum system and method to deposit a compound layer (2025-01-28),
8. 11952654 - Liquid sputter target (2024-04-09),
9. 11848179 - Methods of and apparatus for magnetron sputtering (2023-12-19),
10. 11776825 - Chamber for degassing substrates (2023-10-03),
11. 11742187 - RF capacitive coupled etch reactor (2023-08-29),
12. 11551950 - Substrate processing apparatus and method of processing a substrate and of manufacturing a processed workpiece (2023-01-10),
13. 11476099 - Methods of and apparatus for magnetron sputtering (2022-10-18),
14. 11469085 - Vacuum plasma workpiece treatment apparatus (2022-10-11),
15. 11387079 - Plasma etch chamber and method of plasma etching (2022-07-12),
Evatec AG is a leading global provider of process equipment for the semiconductor and advanced packaging industry. With a strong focus on innovation, Evatec offers solutions for semiconductor manufacturing processes including deposition, etch and ion beam technologies. The company's advanced thin film deposition systems enable the production of high-performance semiconductor devices used in various applications such as smartphones, automotive electronics, and IoT devices.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

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50 Patents

#1 in Trübbach

#279 in Switzerland

#13,590 in the World

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Trübbach, Switzerland

Evatec Ag

Forward Citations = 124

52 inventors:

goldMedal Jurgen Weichart (11 out of 14 patents)

silverMedal Stanislav Kadlec (7 out of 17 patents)

bronzeMedal Juergen Weichart (6 out of 14 patents)

4.  Rogier Lodder (6 out of 7 patents)

5.  Mohamed Elghazzali (5 out of 7 patents)

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