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Trubbach, Switzerland

Evatec Ag

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USPTO Granted Patents = 53

% Expired Patents = 13.2

EPO Patents = 38

Trademarks = 4

Forward Citations = 138

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61 inventors (with patents filed for the assignee):

Jurgen Weichart (11 out of 14 patents)

Stanislav Kadlec (7 out of 18 patents)

Juergen Weichart (6 out of 14 patents)

4. Rogier Lodder (6 out of 7 patents)

5. Mohamed Elghazzali (5 out of 7 patents)

6. Bart Scholte Von Mast (5 out of 6 patents)

7. Stephan Voser (5 out of 5 patents)

8. Jürgen Weichart (5 out of 9 patents)

9. Hartmut Rohrmann (5 out of 6 patents)

10. Martin Bless (4 out of 4 patents)

11. Rolf Bazlen (4 out of 6 patents)

12. Wolfgang Rietzler (4 out of 5 patents)

13. Sven Uwe Rieschl (4 out of 4 patents)

14. Bruno Gaechter (4 out of 4 patents)

15. Martin Kratzer (4 out of 5 patents)

Core Competencies:

Thin Film Deposition

Sputtering Apparatus

Vacuum Treatment

Piezoelectric Coatings

Magnetron Sputtering

RF Capacitive Coupled Etch

Vacuum Plasma Processing

Optical Monitoring

HIPIMS

Wafer Holder

Substrate Processing

Liquid Sputter Target

53 patents: Sort by Forward Citations

1. 12740377 - Substrate support unit, and apparatus and method for depositing a layer using the same (2026-09-15),

2. 12604700 - Vacuum treatment apparatus and methods for manufacturing vacuum treated substrates (2026-04-14),

3. 12595550 - Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated (2026-04-07),

4. 12493016 - Measuring device and method for measuring parameters of a piezoelectric crystal onto which a thin film of material is deposited as well as thin-film deposition systems with such a device and a method for controlling such systems (2025-12-09),

5. 12426506 - Piezoelectric coating and deposition process (2025-09-23),

6. 12389797 - Deposition process for piezoelectric coatings (2025-08-12),

7. 12272525 - Sputtering apparatus for coating of 3D-objects (2025-04-08),

8. 12249523 - Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer (2025-03-11),

9. 12211715 - Substrate vacuum treatment apparatus and method therefor (2025-01-28),

10. 12209302 - Vacuum system and method to deposit a compound layer (2025-01-28),

11. 11952654 - Liquid sputter target (2024-04-09),

12. 11848179 - Methods of and apparatus for magnetron sputtering (2023-12-19),

13. 11776825 - Chamber for degassing substrates (2023-10-03),

14. 11742187 - RF capacitive coupled etch reactor (2023-08-29),

15. 11551950 - Substrate processing apparatus and method of processing a substrate and of manufacturing a processed workpiece (2023-01-10),

Company Overview

Evatec AG, headquartered in Trubbach, Switzerland, specializes in advanced thin film deposition technologies. The company is renowned for its expertise in sputtering apparatus and vacuum treatment processes, catering to various industries including electronics and optics. Evatec focuses on innovative solutions such as piezoelectric coatings and magnetron sputtering, alongside RF capacitive coupled etching and vacuum plasma processing. Their commitment to optical monitoring enhances the precision and quality of thin film applications, positioning them as a leader in the field.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

53 Patents

#1 in Trubbach

#279 in Switzerland

#13,348 in the World

Trubbach, Switzerland

Evatec Ag

Forward Citations = 138

61 inventors:

Jurgen Weichart (11 out of 14 patents)

Stanislav Kadlec (7 out of 18 patents)

Juergen Weichart (6 out of 14 patents)

4. Rogier Lodder (6 out of 7 patents)

5. Mohamed Elghazzali (5 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Evatec Ag. Retrieved from https://idiyas.com/company/evatec-ag

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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