The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Sep. 18, 2019
Applicant:

Evatec Ag, Trübbach, CH;

Inventor:

Boris Trajcevski, Sax, CH;

Assignee:

EVATEC AG, Trübbach, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C23C 14/02 (2006.01); C23C 14/58 (2006.01); H10N 30/00 (2023.01); H10N 30/076 (2023.01); H10N 30/079 (2023.01); H10N 30/853 (2023.01);
U.S. Cl.
CPC ...
H10N 30/079 (2023.02); C23C 14/0036 (2013.01); C23C 14/021 (2013.01); C23C 14/025 (2013.01); C23C 14/5806 (2013.01); H10N 30/076 (2023.02); H10N 30/708 (2024.05); H10N 30/853 (2023.02);
Abstract

A method to deposit a coating including a material with highly oriented microstructure, the method including at least the following sequence of process steps: providing a flat substrate into a first vacuum processing chamber; etching one surface of the substrate by physical vapor etching; depositing a first metallic layer on the etched substrate surface by sputtering in a first metal deposition step; annealing the first metallic layer at an annealing temperature at least 50° C. higher than a compound deposition temperature of the subsequent compound deposition step; depositing a first compound layer at the compound deposition temperature on the outer surface of the first metallic layer by reactive sputtering in a first compound deposition step; and depositing a second metallic layer on the outer surface of the first compound layer by sputtering in a second metal deposition step.


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