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For the Inventor, By the Inventor

Anyang, South Korea

Eo Technics Co., Ltd


USPTO Granted Patents = 26

% Expired Patents = 3.8


Forward Citations = 42

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63 inventors (with patents filed for the assignee):

goldMedal Sung Beom Jung (5 out of 5 patents)

silverMedal Kyu Dong Sung (4 out of 4 patents)

bronzeMedal Soo Young Kim (4 out of 28 patents)

4.  Eun-Jeong Hong (3 out of 3 patents)

5.  You Hie Han (3 out of 3 patents)

6.  Chang Su Jun (3 out of 3 patents)

7.  Ill Hyun Park (2 out of 3 patents)

8.  Jea Ho Moon (2 out of 2 patents)

9.  Hak-Yong Lee (2 out of 2 patents)

10.  You-hie Han (2 out of 2 patents)

11.  Dong Jun Lee (2 out of 60 patents)

12.  Sang Young Park (2 out of 21 patents)

13.  Hak Yong Lee (2 out of 2 patents)

14.  Doo Seok Lee (2 out of 2 patents)

15.  Hans Juergen Kahlert (2 out of 2 patents)


Core Competencies:
Laser Annealing
Semiconductor Device
Marking Method
Wafer Inspection
Reflectivity
Warpage Reduction
Laser Machining
Variable-Pulse-Width
Chip Scale Marker
Automatic Inspection
Laser Processing
Multi-Laser System

26 patents:

1. 12521819 - Laser annealing system and method of fabricating a semiconductor device using the same (2026-01-13),
2. 12405478 - Apparatus for laser annealing and operating method thereof (2025-09-02),
3. 12370625 - Variable-pulse-width flat-top laser device and operating method therefor (2025-07-29),
4. 12214442 - Variable-pulse-width flat-top laser device and operating method therefor (2025-02-04),
5. 11621184 - Laser marking device and laser marking method (2023-04-04),
6. 11478828 - Adhesive removing device and method (2022-10-25),
7. 11158510 - Monitoring device, monitoring method and method of manufacturing semiconductor device using reflectivity of wafer (2021-10-26),
8. 11065805 - Warpage reduction device and warpage reduction method (2021-07-20),
9. 10867828 - Marking position correcting apparatus and method (2020-12-15),
10. 10861725 - Laser marking device and laser marking method (2020-12-08),
11. 10770298 - Automatic inspection device and method of laser processing equipment (2020-09-08),
12. 10304778 - Wafer marking method (2019-05-28),
13. 10290525 - Marking method for wafer dice (2019-05-14),
14. 10286485 - Laser processing device and laser processing method (2019-05-14),
15. 10134681 - Laser processing method for cutting semiconductor wafer having metal layer formed thereon and laser processing device (2018-11-20),
Company Overview
Eo Technics Co., Ltd is a South Korean company specializing in advanced laser technology and equipment. The organization focuses on developing innovative solutions for various industries, including semiconductor manufacturing, display technology, and precision optics. With a commitment to research and development, Eo Technics aims to enhance production efficiency and product quality through its cutting-edge technologies. The company plays a significant role in the global market, contributing to advancements in laser applications and systems integration.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

26 Patents

#7 in Anyang

#510 in South Korea

#24,781 in the World

Anyang, KR
Anyang, South Korea

Eo Technics Co., Ltd

Forward Citations = 42

63 inventors:

goldMedal Sung Beom Jung (5 out of 5 patents)

silverMedal Kyu Dong Sung (4 out of 4 patents)

bronzeMedal Soo Young Kim (4 out of 28 patents)

4.  Eun-Jeong Hong (3 out of 3 patents)

5.  You Hie Han (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Eo Technics Co., Ltd. Retrieved from https://idiyas.com/company/eo-technics-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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