The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Aug. 11, 2014
Applicant:
Eo Technics Co., Ltd., Anyang-si, Gyeonggi-do, KR;
Inventors:
Assignee:
EO TECHNICS CO., LTD, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); C03C 23/00 (2006.01); H01L 21/268 (2006.01); H01L 21/683 (2006.01); B23K 26/00 (2014.01); B23K 26/18 (2006.01); B23K 26/082 (2014.01); B23K 26/352 (2014.01); H01L 21/67 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); B23K 26/0006 (2013.01); B23K 26/082 (2015.10); B23K 26/18 (2013.01); B23K 26/352 (2015.10); B23K 26/355 (2018.08); C03C 23/0025 (2013.01); H01L 21/268 (2013.01); H01L 21/6836 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); H01L 21/67282 (2013.01); H01L 2223/54433 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Disclosed is a wafer marking method using a laser for marking a wafer having processing tape attached thereto. The disclosed laser marking method comprises the steps of: penetrating a 532-nm wavelength laser beam through the processing tape attached to one side of the wafer; and performing marking on the one side of the wafer by moving the 532-nm wavelength laser beam at a predetermined velocity, wherein the 532-nm wavelength laser beam has a frequency of 8 kHz to 40 kHz, and an output power of 0.8 W to 2 W.