For the Inventor, By the Inventor

Enter assignee name

Cham, Switzerland

Besi Switzerland Ag

USPTO Granted Patents = 19

EPO Patents = 1

Forward Citations = 24

Loading Chart...

Loading Chart...

29 inventors (with patents filed for the assignee):

Andreas Mayr (5 out of 5 patents)

Norbert Bilewicz (4 out of 4 patents)

Hubert Selhofer (4 out of 4 patents)

4. Florian Speer (4 out of 4 patents)

5. Hugo Pristauz (3 out of 3 patents)

6. Hannes Kostner (2 out of 3 patents)

7. Dietmar Lackner (2 out of 2 patents)

8. Martin Widauer (2 out of 2 patents)

9. Heinrich Berchtold (2 out of 3 patents)

10. Ernst Barmettler (2 out of 2 patents)

11. Fabian Hurschler (2 out of 2 patents)

12. Brian Pulis (2 out of 2 patents)

13. Harald Handlos (1 out of 1 patent)

14. Juergen Stuerner (1 out of 2 patents)

15. Christoffer Stroemberg (1 out of 1 patent)

19 patents: Sort by Forward Citations

1. 12230599 - Method for actuating a bonding head (2025-02-18),

2. 12062566 - Die ejector (2024-08-13),

3. 12046490 - Bonding head for mounting components and die bonder with such a bonding head (2024-07-23),

4. 11996385 - Apparatus and method for detaching a die from an adhesive film (2024-05-28),

5. 11924974 - Apparatus for mounting components on a substrate (2024-03-05),

6. 11696429 - Apparatus and method for mounting components on a substrate (2023-07-04),

7. 10973158 - Apparatus and method for mounting components on a substrate (2021-04-06),

8. 10629465 - Method for calibrating a component mounting apparatus (2020-04-21),

9. 10288413 - Apparatus for mounting components on a substrate (2019-05-14),

10. 9956692 - Kinematic holding system for a placement head of a placement apparatus (2018-05-01),

11. 9889516 - Device for dispensing and distributing flux-free solder on a substrate (2018-02-13),

12. 9721819 - Method for mounting semiconductors provided with bumps on substrate locations of a substrate (2017-08-01),

13. 9666460 - Through type furnace for substrates comprising a longitudinal slit (2017-05-30),

14. 9364953 - Kinematic holding system for a placement head of a placement apparatus (2016-06-14),

15. 9339885 - Method and apparatus for dispensing flux-free solder on a substrate (2016-05-17),

Besi Switzerland AG provides leading semiconductor and electronics assembly solutions. With years of experience, state-of-the-art technology, and innovative solutions, Besi helps customers achieve higher productivity and efficiency in the semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 16 2025

19 Patents

#7 in Cham

#621 in Switzerland

#31,678 in the World

Cham, Switzerland

Besi Switzerland Ag

Forward Citations = 24

29 inventors:

Andreas Mayr (5 out of 5 patents)

Norbert Bilewicz (4 out of 4 patents)

Hubert Selhofer (4 out of 4 patents)

4. Florian Speer (4 out of 4 patents)

5. Hugo Pristauz (3 out of 3 patents)

Please report any incorrect information to support@idiyas.com

Loading…