The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Jun. 12, 2013
Applicant:
Besi Switzerland Ag, Cham, CH;
Inventors:
Heinrich Berchtold, Luzern, CH;
Rene Betschart, Schwyz, CH;
Assignee:
Besi Switzerland AG, Cham, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/06 (2006.01); B23K 1/20 (2006.01); B23K 1/06 (2006.01); B23K 3/02 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); B23K 20/10 (2006.01);
U.S. Cl.
CPC ...
B23K 3/063 (2013.01); B23K 1/06 (2013.01); B23K 1/20 (2013.01); B23K 3/025 (2013.01); H01L 23/49513 (2013.01); H01L 24/03 (2013.01); H01L 24/27 (2013.01); H01L 24/743 (2013.01); B23K 20/10 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/0381 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/2733 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/3841 (2013.01);
Abstract
An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: