The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Jun. 24, 2019
Applicant:
Besi Switzerland Ag, Steinhausen, CH;
Inventors:
Andreas Mayr, Radfeld, AT;
Manfred Dorfer, Radfeld, AT;
Assignee:
BESI SWITZERLAND AG, Steinhausen, CH;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B65G 47/90 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/799 (2013.01); B65G 47/902 (2013.01); H01L 21/6838 (2013.01); B65G 2203/0233 (2013.01);
Abstract
An apparatusfor releasing a diewith a vacuum platformwith two or more segmentsis provided, which may be extended independently of the surface of the vacuum platformto push against the adhesive filmat the respective attachment in the direction of the die gripper. By providing two or more segmentsthat are independently extendable, die detachment (or at least partial detachment) may be performed in parallel, and two or more diesmay be detached before the adhesive filmneeds to be repositioned. Both measures may increase throughput. In addition, empty attachment positions may be omitted.