The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Sep. 28, 2016
Applicant:

Besi Switzerland Ag, Cham, CH;

Inventors:

Norbert Bilewicz, Vomp, AT;

Hubert Selhofer, Innsbruck, AT;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/00 (2006.01); H04N 7/18 (2006.01); G02B 17/00 (2006.01); G02B 27/14 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); G05B 19/406 (2006.01); G01B 11/14 (2006.01);
U.S. Cl.
CPC ...
G01B 11/14 (2013.01); G01B 11/00 (2013.01); G02B 17/008 (2013.01); G02B 27/149 (2013.01); G05B 19/406 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/67259 (2013.01); H01L 24/75 (2013.01); H04N 7/18 (2013.01); G05B 2219/45031 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75753 (2013.01);
Abstract

An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the component is to be mounted. The first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component. The pick and place system moves the carriage from a take-up location of the component to the substrate location in a respective predetermined height Habove the second optical deflection system, so that the bottom side of the component is located in a focal plane of the camera, and lifts the carriage to a respective predetermined height H, so that the substrate location is situated in the focal plane of the camera.


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