The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Nov. 20, 2014
Applicant:

Besi Switzerland Ag, Cham, CH;

Inventors:

Guido Suter, Geuensee, CH;

Kevin Domancich, Knonau, CH;

Daniel Andreas Scherer, Birmensdorf, CH;

Reto Weibel, Hunenberg, CH;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/08 (2006.01); H01L 21/67 (2006.01); B23K 3/04 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); H01L 21/677 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 3/04 (2013.01); B23K 3/087 (2013.01); H01L 21/6776 (2013.01); H01L 21/67098 (2013.01); H01L 21/67109 (2013.01); B23K 2201/42 (2013.01);
Abstract

A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.


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