Company Filing History:
Years Active: 2017
Title: The Innovations of Daniel Andreas Scherer
Introduction
Daniel Andreas Scherer is a notable inventor based in Birmensdorf, Switzerland. He has made significant contributions to the field of engineering, particularly in the development of specialized furnaces for substrate processing. His innovative designs have the potential to enhance manufacturing processes in various industries.
Latest Patents
One of Scherer's key patents is titled "Through type furnace for substrates comprising a longitudinal slit." This invention describes a through-type furnace that includes a channel and a transport system designed for the efficient movement of substrates. The furnace is equipped with a base that features multiple holes connected to a protective gas source, allowing for the supply of protective gas during operation. The front side wall of the channel contains a longitudinal slit that runs parallel to the passage direction, facilitating the transport of substrates through the channel. This design is particularly advantageous for use in soft solder die bonders, showcasing Scherer's innovative approach to furnace technology. He holds 1 patent.
Career Highlights
Scherer is currently employed at Besi Switzerland AG, where he continues to develop and refine his inventions. His work at the company has positioned him as a key player in the field of substrate processing technology. His contributions have not only advanced the capabilities of manufacturing equipment but have also set new standards for efficiency and effectiveness in the industry.
Collaborations
Throughout his career, Scherer has collaborated with talented professionals such as Guido Suter and Kevin Domancich. These partnerships have allowed for the exchange of ideas and expertise, further enhancing the innovative potential of their projects.
Conclusion
Daniel Andreas Scherer is a distinguished inventor whose work in furnace technology has made a significant impact on the industry. His innovative designs and collaborative efforts continue to drive advancements in substrate processing.