Fabian Hurschler

Title: Innovations by Fabian Hurschler

Introduction

Fabian Hurschler is an accomplished inventor based in Lucerne, Switzerland. He has made significant contributions to the field of technology, particularly in the area of semiconductor manufacturing. With a total of two patents to his name, Hurschler's work showcases his innovative spirit and technical expertise.

Latest Patents

Hurschler's latest patents include a die ejector and a method for detaching a semiconductor chip from a foil. The die ejector comprises a chamber with a cover plate featuring a passageway, along with a plurality of plates that are arranged inside the chamber. These plates are designed to be reciprocally movable between an initial position and an operating position, facilitating the removal of dies from a carrier. The die ejector also incorporates a magnet and a spring system that interact with anchor sections of the plates, exerting an attraction force or an impact force directed towards the operating position. Additionally, a stop member is included to halt the movement of the plates in the operating position. The method for detaching a semiconductor chip utilizes a die ejector with plates that have both straight and L-shaped supporting edges.

Career Highlights

Hurschler is currently employed at Besi Switzerland AG, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Hurschler has collaborated with notable colleagues, including Brian Pulis and Ernst Barmettler, who have contributed to his projects and innovations.

Conclusion

Fabian Hurschler's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor in the semiconductor industry. His innovative designs and methods continue to influence advancements in manufacturing processes.