Besi Switzerland Ag

Fabian Hurschler

Brian Pulis

Stefan Behler

Ernst Barmettler

A die-ejector () comprising a chamber () with a cover plate () having a passageway, a plurality of plates () arranged inside the chamber () and reciprocally movable between an initial position () and an operating position (), respectively, intended to interact with the carrier to support the removal of the dies from the carrier, and a drive member () for moving the plates () to be moved from the operating position towards the initial position. The die-ejector () further comprises a magnet () and a spring system, respectively, which interacts with anchor sections () of the plates () and exerts on the plates () an attraction force (F') or an impact force, respectively, directed towards the operating position, and a stop member () for stopping the movement of the plates () in the operating position, the plates abutting the stop member () in the operating position.

Die ejector

A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises:

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Lucerne, Switzerland

Fabian Hurschler