The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

May. 04, 2019
Applicant:

Besi Switzerland Ag, Steinhausen, CH;

Inventors:

Harald Handlos, Kundl, AT;

Florian Speer, Langkampen, AT;

Juergen Stuerner, Volders, AT;

Assignee:

BESI Switzerland AG, Steinhausen, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); H01L 21/67259 (2013.01); H01L 22/22 (2013.01); H01L 22/32 (2013.01); H01L 23/544 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/74 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/8013 (2013.01);
Abstract

The invention concerns the calibration of a component mounting apparatus configured to mount components on a substrate whose mounting places do not contain local markings. The substrate contains either global substrate markings attached to its edge or other global features that can be used to mount the components. Calibration is carried out by means of a calibration plate which has several calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings, a test chip which has second optical markings, and a holder attached to the bonding station for temporarily accommodating the calibration plate. The number and arrangement of the calibration positions of the calibration plate and the number and arrangement of the mounting places of the substrate are—apart from possible exceptions—different from one another.


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