The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Mar. 09, 2021
Applicant:

Besi Switzerland Ag, Cham, CH;

Inventors:

Norbert Bilewicz, Vomp, AT;

Andreas Mayr, Wiesing, AT;

Hugo Pristauz, St. Johann i. Tirol, AT;

Hubert Selhofer, Innsbruck, AT;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 13/08 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0413 (2013.01); H01L 21/67144 (2013.01); H01L 21/67276 (2013.01); H01L 21/681 (2013.01); H01L 24/741 (2013.01); H05K 13/046 (2013.01); H05K 13/0815 (2018.08); G05B 2219/45031 (2013.01);
Abstract

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.


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