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Apic Yamada Corporation

USPTO Granted Patents = 38

% Expired Patents = 18.4

EPO Patents = 6

Trademarks = 2

Forward Citations = 390

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52 inventors (with patents filed for the assignee):

Fumio Miyajima (19 out of 19 patents)

Kazuhiko Kobayashi (5 out of 5 patents)

Tsutomu Miyagawa (5 out of 5 patents)

4. Masahiko Fujisawa (5 out of 9 patents)

5. Yoshikazu Muramatsu (4 out of 4 patents)

6. Hideaki Nakazawa (4 out of 4 patents)

7. Makoto Kawaguchi (3 out of 5 patents)

8. Shusaku Tagami (3 out of 3 patents)

9. Kunihiro Aoki (3 out of 3 patents)

10. Masanori Maekawa (2 out of 2 patents)

11. Fumihito Ishida (2 out of 2 patents)

12. Masao Nishizawa (2 out of 2 patents)

13. Kenji Kida (2 out of 2 patents)

14. Naoya Gotoh (2 out of 2 patents)

15. Yasuhiko Miyashita (2 out of 2 patents)

Core Competencies:

Resin Molding

RFID Tag

Electrostatic Spraying

Bonding Apparatus

Compression Molding

Molding Machine

Sealing Method

Thin Film Coating

Semiconductor Devices

Release Film

Transport Die

Lead Frame Taping

38 patents: Sort by Forward Citations

1. 12409586 - Resin-sealing apparatus and resin-sealing method (2025-09-09),

2. 12240153 - Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product (2025-03-04),

3. 12179395 - Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product (2024-12-31),

4. 11784069 - Resin molding apparatus (2023-10-10),

5. 9831187 - Apparatus and method for electrostatic spraying or electrostatic coating of a thin film (2017-11-28),

6. 9738014 - Resin molding machine (2017-08-22),

7. 9238314 - Method for resin molding and resin molding apparatus (2016-01-19),

8. 9129203 - RFID tag, method for producing RFID tag, and mold (2015-09-08),

9. 9016342 - Bonding apparatus and bonding method (2015-04-28),

10. 8967484 - RFID tag, wireless charging antenna part, method of manufacturing the same, and mold (2015-03-03),

11. 8727757 - Molding die set and resin molding apparatus having the same (2014-05-20),

12. 7909596 - Resin molding machine and method of resin molding (2011-03-22),

13. 7407608 - Resin molding equipment and resin molding method (2008-08-05),

14. 7175405 - Compression molding machine (2007-02-13),

15. 7153116 - Resin molding machine (2006-12-26),

Company Overview

Apic Yamada Corporation, based in Nagano, Japan, specializes in the development and manufacturing of advanced electronic components and systems. The company focuses on innovative solutions in the fields of automotive technology, industrial automation, and consumer electronics. With a commitment to quality and precision, Apic Yamada leverages cutting-edge research to enhance product performance and reliability, catering to a diverse range of industries both domestically and internationally.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

38 Patents

#33 in Nagano

#2,025 in Japan

#17,844 in the World

Apic Yamada Corporation

Forward Citations = 390

52 inventors:

Fumio Miyajima (19 out of 19 patents)

Kazuhiko Kobayashi (5 out of 5 patents)

Tsutomu Miyagawa (5 out of 5 patents)

4. Masahiko Fujisawa (5 out of 9 patents)

5. Yoshikazu Muramatsu (4 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Apic Yamada Corporation. Retrieved from https://idiyas.com/company/apic-yamada

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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