Nagano, Japan

Kunihiro Aoki

This inventor holds 3 USPTO granted patents. Top assignee: Apic Yamada Corporation. Active years: 2001-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kunihiro Aoki. Retrieved from https://idiyas.com/inventor/kunihiro-aoki-h6aqruev

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 3

Forward Citations = 53(Granted Patents)


Company Filing History:


Years Active: 2001-2004

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3 patents (USPTO):Explore Patents

Title: Innovator Kunihiro Aoki: Pioneering Advances in Resin Molding Technology

Introduction

Kunihiro Aoki, an accomplished inventor based in Nagano, Japan, has made significant contributions to the field of resin molding technology. With three patents to his name, Aoki has established himself as a leading figure in creating innovative solutions that enhance efficiency and reliability in manufacturing processes.

Latest Patents

Aoki's latest patents include a "Resin Molding Machine and Method of Resin Molding" and an "Apparatus for Sealing a Semiconductor Device Utilizing a Release Film." The resin molding machine is designed to securely and efficiently mold workpieces that have multiple elements arranged on them. This invention features a lower die, an upper die with a clamper for resin molding, and a unique release film feeding mechanism that ensures easy peeling from the upper die and resin.

Furthermore, his apparatus for sealing a semiconductor device utilizes a transfer molding process where sealing resin fills the underfilled portions between solder bumps and semiconductor chips. By employing a release film technique that closes the perimeter of the underfilled portion during the molding process, Aoki's method contributes to enhanced reliability in semiconductor manufacturing.

Career Highlights

Kunihiro Aoki is currently affiliated with Apic Yamada Corporation, where he plays a crucial role in advancing the company’s technological capabilities. His innovative approach and practical solutions in resin molding have not only earned him patents but also recognition within the industry. Aoki's dedication to improving manufacturing processes underscores his contributions to modern technology.

Collaborations

During his career, Aoki has collaborated with notable colleagues like Tsutomu Miyagawa and Fumio Miyajima. Together, they have worked on developing advanced technologies that drive efficiency in resin molding and semiconductor sealing processes. This collaborative spirit reflects the collective effort required to innovate in complex technical fields.

Conclusion

Kunihiro Aoki exemplifies the spirit of innovation in the resin molding industry. With three patents that address critical challenges faced in manufacturing, Aoki’s contributions demonstrate how inventive solutions can lead to more effective technologies. His work at Apic Yamada Corporation, alongside talented colleagues, ensures that the future of resin molding and semiconductor technology continues to evolve.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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