The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Jan. 22, 1999
Tsutomu Miyagawa, Nagano, JP;
Kunihiro Aoki, Nagano, JP;
Masahiro Kodama, Nagano, JP;
Fumio Miyajima, Nagano, JP;
Apic Yamada Corporation, Nagaano, JP;
Abstract
A resin sealing method for sealing a joining portion between a semiconductor chip,and a substrate,by filling a underfilled portion of a molded piece,in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin,by a transfer molding process, the method being characterized in that when the molded piece,is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film,, and in a state that the perimeter of the underfilled portion is closed, the sealing resin,having been supplied to a pot,provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile