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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9738014 B1

PDFFull Text
Date of Patent:
Aug. 22, 2017

Filed:

Nov. 23, 2011

Resin molding machine

Applicants:

Tetsuya Maeyama, Chikuma, JP;

Hidemichi Kobayashi, Chikuma, JP;

Shusaku Tagami, Chikuma, JP;

Yoshikazu Muramatsu, Chikuma, JP;

Takayuki Yamazaki, Chikuma, JP;

Keiji Koyama, Chikuma, JP;

Hideaki Nakazawa, Chikuma, JP;

Hiroshi Harayama, Chikuma, JP;

Kenji Nishizawa, Chikuma, JP;

Makoto Kawaguchi, Chikuma, JP;

Masahiko Fujisawa, Chikuma, JP;

Hidetoshi Oya, Chikuma, JP;

Inventors:

Tetsuya Maeyama, Chikuma, JP;

Hidemichi Kobayashi, Chikuma, JP;

Shusaku Tagami, Chikuma, JP;

Yoshikazu Muramatsu, Chikuma, JP;

Takayuki Yamazaki, Chikuma, JP;

Keiji Koyama, Chikuma, JP;

Hideaki Nakazawa, Chikuma, JP;

Hiroshi Harayama, Chikuma, JP;

Kenji Nishizawa, Chikuma, JP;

Makoto Kawaguchi, Chikuma, JP;

Masahiko Fujisawa, Chikuma, JP;

Hidetoshi Oya, Chikuma, JP;

Assignee:

APIC YAMADA CORPORATION, Chikuma-Shi, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Robert J Grun

Int. Cl.
CPC ...
B29C 31/04 (2006.01); B29C 43/58 (2006.01); B29C 43/18 (2006.01); B29C 31/00 (2006.01); B29C 37/00 (2006.01); H01L 21/56 (2006.01); B29C 35/02 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); B29C 31/008 (2013.01); B29C 37/001 (2013.01); H01L 21/565 (2013.01); B29C 31/042 (2013.01); B29C 35/02 (2013.01); B29C 45/1468 (2013.01); B29C 2043/181 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.

Find Patent Forward Citations

Maeyama, Tetsuya. (2017). Resin molding machine (U.S. Patent No. 9738014). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9738014

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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