Chikuma, Japan

Hideaki Nakazawa

This inventor holds 4 USPTO granted patents and 2 EPO patents. Top assignee: Apic Yamada Corporation. Active years: 2004-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideaki Nakazawa. Retrieved from https://idiyas.com/inventor/hideaki-nakazawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 75.0


Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 25(Granted Patents)


Location History:

  • Nagano, JP (2004 - 2007)
  • Chikuma, JP (2016 - 2017)

Company Filing History:


Years Active: 2004-2017

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4 patents (USPTO):Explore Patents

Title: Innovations by Inventor Hideaki Nakazawa

Introduction

Hideaki Nakazawa, an accomplished inventor based in Chikuma, Japan, has made significant contributions to the field of resin molding technology. With a total of four patents to his name, Nakazawa's work focuses on improving the efficiency and effectiveness of resin molding processes.

Latest Patents

Among Nakazawa's notable innovations is the compact resin molding machine, designed to perform a sequence of molding actions efficiently. This cutting-edge machine incorporates multiple sections, including a work conveying mechanism with a robotic arm for handling the workpieces, a work feeding section, and a resin feeding section. It also features a press section with a molding die set and a work accommodating section, all under the control of an integrated control section.

Another of Nakazawa's significant patents is a method for resin molding and resin molding apparatus, which allows for the effective resin-molding of one side face of a workpiece. This innovative method includes steps such as sucking and holding a release film on the molding die, positioning the work in the die set, and applying pressure and heat to the resin during the molding process. These advancements represent substantial improvements in resin molding technology, streamlining operations while enhancing product quality.

Career Highlights

Nakazawa works at Apic Yamada Corporation, where he contributes his expertise and innovations in resin molding machinery. His dedication to enhancing molding processes has not only garnered him multiple patents but has also solidified his reputation as a key figure in the industry.

Collaborations

Throughout his career, Nakazawa has collaborated with talented professionals such as Shusaku Tagami and Tsutomu Miyagawa. Working alongside these skilled colleagues, he has driven advancements in resin molding technology, showcasing the power of teamwork in innovation.

Conclusion

Inventor Hideaki Nakazawa continues to push the boundaries of resin molding technology with his innovative patents and collaborative efforts. His work at Apic Yamada Corporation exemplifies the importance of creativity and ingenuity in developing cutting-edge solutions that shape industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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