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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9238314 B1

PDFFull Text
Date of Patent:
Jan. 19, 2016

Filed:

Nov. 29, 2012

Method for resin molding and resin molding apparatus

Applicant:

Apic Yamada Corporation, Chikuma-shi, Nagano, JP;

Inventors:

Shusaku Tagami, Chikuma, JP;

Yoshikazu Muramatsu, Chikuma, JP;

Masanori Maekawa, Chikuma, JP;

Hideaki Nakazawa, Chikuma, JP;

Masahiko Fujisawa, Chikuma, JP;

Takuya Miyamoto, Chikuma, JP;

Assignee:

APIC YAMADA CORPORATION, Chikuma-Shi, JP;

Attorney:

Birch, Stewart, Kolasch & Birch LLP

Primary Examiner:

Robert B Davis

Int. Cl.
CPC ...
B29C 33/68 (2006.01); B29C 43/18 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); B29C 33/68 (2013.01); H01L 21/566 (2013.01); B29C 2043/181 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The method is capable of resin-molding one side face of a work in a molding die set, in which the work is sucked and held on at least one of clamping faces and resin-molded in a cavity concave section. The method comprises the steps of: sucking and holding a release film which covers at least one of the clamping faces of the molding die set; setting the work in the molding die set; sucking the other side face of the work through a work sucking hole of the release film, which is formed before or after holding the release film, so as to hold the work on the clamping face; closing the molding die set so as to clamp the work; and pressurizing and heating the resin, which has been accommodated in the cavity concave section, with resin.

Find Patent Forward Citations

Tagami, Shusaku. (2016). Method for resin molding and resin molding apparatus (U.S. Patent No. 9238314). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9238314

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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