The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Nov. 20, 2007
Fumio Miyajima, Chikuma, JP;
Yoshio Watanabe, Chikuma, JP;
Tetsuya Nishizawa, Chikuma, JP;
Hiroaki Yamagishi, Chikuma, JP;
Mitsugi Yoshino, Chikuma, JP;
Takashi Katayama, Chikuma, JP;
Fumio Miyajima, Chikuma, JP;
Yoshio Watanabe, Chikuma, JP;
Tetsuya Nishizawa, Chikuma, JP;
Hiroaki Yamagishi, Chikuma, JP;
Mitsugi Yoshino, Chikuma, JP;
Takashi Katayama, Chikuma, JP;
Apic Yamada Corporation, Chikuma-Shi, Nagano, JP;
Abstract
The resin molding machine is capable of cleaning a resin molding die while performing a molding action without stopping the molding action and capable of securely removing contaminations from the resin molding die. The resin molding machine comprises: a press unit including a resin molding die; and a cleaning unit for cleaning a molding face of the resin molding die. The cleaning unit has an energy ray irradiation section, which irradiates an energy ray to the molding face of the resin molding die so as to easily peel off a contamination, which has been stuck on the molding face during a molding action, from the molding face. The contamination is stuck onto resin of a molded product when the product is resin-molded, so that the molded product is released from the resin molding die together with the contamination.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile