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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11784069 B1

PDFFull Text
Date of Patent:
Oct. 10, 2023

Filed:

Apr. 28, 2021

Resin molding apparatus

Applicant:

Apic Yamada Corporation, Nagano, JP;

Inventors:

Masahiko Fujisawa, Nagano, JP;

Hirofumi Saito, Nagano, JP;

Assignee:

APIC YAMADA CORPORATION, Nagano, JP;

Attorney:

JCIPRNET

Primary Examiner:

Robert J Grun

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B29C 43/18 (2006.01); B29C 43/58 (2006.01); B29C 43/36 (2006.01); B29C 43/52 (2006.01); B29C 43/34 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67126 (2013.01); B29C 43/18 (2013.01); B29C 43/34 (2013.01); B29C 43/36 (2013.01); B29C 43/52 (2013.01); B29C 43/58 (2013.01); B29C 2043/3405 (2013.01); B29C 2043/5808 (2013.01); B29C 2043/5833 (2013.01); B29L 2031/34 (2013.01);
Abstract

To provide a resin molding apparatus capable of correcting the bending of a workpiece during preheating or the like, improving production efficiency, and preventing the occurrence of defective products. A resin molding apparatus according to the present invention includes: a molding die which performs resin molding of a workpiece W having an electronic component mounted inside a carrier; and a loader which transports the workpiece, the loader includes a frame body which comes into contact with and separates from an outer edge portion of an upper surface of the workpiece, a moving device which moves the frame body up and down, and a chuck claw which comes into contact with an outer edge portion of a lower surface of the workpiece, and the frame body includes a contact portion which is provided over the entire circumference of the outer edge portion in the upper surface of the workpiece.

Find Patent Forward Citations

Fujisawa, Masahiko. (2023). Resin molding apparatus (U.S. Patent No. 11784069). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11784069

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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