The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Nov. 01, 2005
Fumio Miyajima, Chikuma, JP;
Kazuhiko Kobayashi, Chikuma, JP;
Kenji Nakajima, Chikuma, JP;
Naoya Gotoh, Chikuma, JP;
Kazuhiko Kobayashi, Chikuma, JP;
Kazuro Wada, Chikuma, JP;
Haruhisa Makino, Chikuma, JP;
Haruhisa Takahashi, Chikuma, JP;
Fumio Miyajima, Chikuma, JP;
Kazuhiko Kobayashi, Chikuma, JP;
Kenji Nakajima, Chikuma, JP;
Naoya Gotoh, Chikuma, JP;
Kazuhiko Kobayashi, Chikuma, JP;
Kazuro Wada, Chikuma, JP;
Haruhisa Makino, Chikuma, JP;
Haruhisa Takahashi, Chikuma, JP;
APIC Yamada Corporation, Nagano, JP;
Abstract
The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile